1. Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly
پدیدآورنده : Hwang, Jennie S.
کتابخانه: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
موضوع : Design and construction ، Printed circuits,، Solder pastes,، Surface mount technology
رده :
TK
7868
.
P7
H82
1989
2. Solder paste in electronics packaging :technology and applications in surface mount, hybrid circuits, and component assembly
پدیدآورنده : Jennie S. Hwang
کتابخانه: Central Library and Information Center of Shahed University (Tehran)
موضوع : Printed circuits--Design and construction,Solder pastes,Surface mount technology
رده :
TK
،
7868
،.
P7
,
H82
،
1989
